Reflow soldering processes [electronic resource] SMT, BGA, CSP and flip chip technologies Ning-Cheng Lee
Τύπος υλικού: ΚείμενοΓλώσσα: Αγγλικά Λεπτομέρειες δημοσίευσης: Boston Newnes c2002Περιγραφή: ix, 270 σ. εικ. 26 εκISBN:- 9780750672184
- 0750672188
- 621.381/046 22
- TK7836 .L43 2002eb
Τύπος τεκμηρίου | Τρέχουσα βιβλιοθήκη | Ταξιθετικός αριθμός | Κατάσταση | Ημερομηνία λήξης | Ραβδοκώδικας |
---|---|---|---|---|---|
Electronic Resource | ΒΚΠ - Πατρα | 621.381/046 LEE (Περιήγηση στο ράφι(Άνοιγμα παρακάτω)) | Διαθέσιμο |
Browsing ΒΚΠ - Πατρα shelves Κλείσιμο περιήγησης ραφιού(Απόκρυψη περιήγησης ραφιών)
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621.381 045 ΧΩΧ Σύνθεση και μελέτη ιδιοτήτων νέων συζυγιακών πολυμερών για οπτικο-ηλεκτρονικές εφαρμογές | 621.381 046 FUN Fundamentals of microsystems packaging / | 621.381 046 H Semiconductor packaging | 621.381/046 LEE Reflow soldering processes SMT, BGA, CSP and flip chip technologies | 621.381 046 LIC Multichip module design,fabrication, and testing | 621.381 046 M Mechanical analysis of electronic pakaging systems | 621.381 046 TUM Microelectronics Packaging Handbook |
Περιέχει βιβλιογραφικές παραπομπές και ευρετήριο
Introduction to Surface Mount Electronic Packaging Technology; Fundamentals of Solders and Soldering (includes Soldering Theory, Effect of Elemental Constituents on Wetting, Phase Diagram and Soldering, Microstructure and Soldering, Effect of Impurities on Soldering); Solder Paste Technology (includes Fluxing Reactions, Flux Chemistry, Solder Powder, Solder Paste Composition and Manufacturing, Solder Paste Rheology); Surface Mount Assembly Processes (includes Solder Paste Materials, Printer Level Consideration, Effect of Reflow Atmosphere on Soldering, Solder Joint Inspection, In-Circuit Testing); SMT Problems Prior to Reflow (includes Flux Separation, Crusting, Paste Hardening, Poor Stencil Life, Poor Print Thickness, Squeegee Hanging, Slump, Poor Print Quality, Needle Clogging, Low Tack); SMT Problems During Reflow; SMT Problems After Reflow; BGA and CSP Solder Bumping BGA, CSP, and Flip Chip Solder Bumping; BGA and CSP Board Level Assembly (including ; Problems Occurred at Assembly Stage and Rework); BGA and CSP Rework; Flip Chip Reflow Soldering; Optimizing Reflow Profile via Defect Mechanisms Analysis; Lead-Free Soldering Trends of Solder Paste and Flux Technology; How to Select Solder Pastes or Fluxes; Conclusions; Appendix; References; Index
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process