Στοιχεία MARC
| 000 -LEADER |
|---|
| fixed length control field |
04430nam a2200325 u 4500 |
| 001 - CONTROL NUMBER |
|---|
| control field |
10075063 |
| 003 - CONTROL NUMBER IDENTIFIER |
|---|
| control field |
upatras |
| 005 - DATE AND TIME OF LATEST TRANSACTION |
|---|
| control field |
20230914101423.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
|---|
| fixed length control field |
090520s2002 eng |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
|---|
| International Standard Book Number |
9780750672184 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
|---|
| International Standard Book Number |
0750672188 |
| 040 ## - CATALOGING SOURCE |
|---|
| Original cataloging agency |
GR-PaULI |
| Transcribing agency |
GR-PaULI |
| 041 0# - LANGUAGE CODE |
|---|
| Language code of text/sound track or separate title |
eng |
| 050 #4 - LIBRARY OF CONGRESS CALL NUMBER |
|---|
| Classification number |
TK7836 |
| Item number |
.L43 2002eb |
| 082 14 - DEWEY DECIMAL CLASSIFICATION NUMBER |
|---|
| Classification number |
621.381/046 |
| Edition number |
22 |
| 100 1# - MAIN ENTRY--PERSONAL NAME |
|---|
| Personal name |
Lee, Ning-Cheng |
| 9 (RLIN) |
74999 |
| 245 10 - TITLE STATEMENT |
|---|
| Title |
Reflow soldering processes |
| Medium |
[electronic resource] |
| Remainder of title |
SMT, BGA, CSP and flip chip technologies |
| Statement of responsibility, etc. |
Ning-Cheng Lee |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) |
|---|
| Place of publication, distribution, etc. |
Boston |
| Name of publisher, distributor, etc. |
Newnes |
| Date of publication, distribution, etc. |
c2002 |
| 300 ## - PHYSICAL DESCRIPTION |
|---|
| Extent |
ix, 270 σ. |
| Other physical details |
εικ. |
| Dimensions |
26 εκ |
| 504 ## - BIBLIOGRAPHY, ETC. NOTE |
|---|
| Bibliography, etc |
Περιέχει βιβλιογραφικές παραπομπές και ευρετήριο |
| 505 1# - FORMATTED CONTENTS NOTE |
|---|
| Formatted contents note |
Introduction to Surface Mount Electronic Packaging Technology; Fundamentals of Solders and Soldering (includes Soldering Theory, Effect of Elemental Constituents on Wetting, Phase Diagram and Soldering, Microstructure and Soldering, Effect of Impurities on Soldering); Solder Paste Technology (includes Fluxing Reactions, Flux Chemistry, Solder Powder, Solder Paste Composition and Manufacturing, Solder Paste Rheology); Surface Mount Assembly Processes (includes Solder Paste Materials, Printer Level Consideration, Effect of Reflow Atmosphere on Soldering, Solder Joint Inspection, In-Circuit Testing); SMT Problems Prior to Reflow (includes Flux Separation, Crusting, Paste Hardening, Poor Stencil Life, Poor Print Thickness, Squeegee Hanging, Slump, Poor Print Quality, Needle Clogging, Low Tack); SMT Problems During Reflow; SMT Problems After Reflow; BGA and CSP Solder Bumping BGA, CSP, and Flip Chip Solder Bumping; BGA and CSP Board Level Assembly (including ; Problems Occurred at Assembly Stage and Rework); BGA and CSP Rework; Flip Chip Reflow Soldering; Optimizing Reflow Profile via Defect Mechanisms Analysis; Lead-Free Soldering Trends of Solder Paste and Flux Technology; How to Select Solder Pastes or Fluxes; Conclusions; Appendix; References; Index |
| 520 ## - SUMMARY, ETC. |
|---|
| Summary, etc. |
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process |
| 650 #4 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name as entry element |
Electronic apparatus and appliances |
| General subdivision |
Design and construction |
| 9 (RLIN) |
75000 |
| 650 #4 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name as entry element |
Electronic packaging |
| 9 (RLIN) |
75002 |
| 650 #4 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name as entry element |
Electric connectors |
| 9 (RLIN) |
75003 |
| 710 2# - ADDED ENTRY--CORPORATE NAME |
|---|
| Corporate name or jurisdiction name as entry element |
ScienceDirect (Online service) |
| 9 (RLIN) |
35187 |
| 856 40 - ELECTRONIC LOCATION AND ACCESS |
|---|
| Materials specified |
ScienceDirect |
| Uniform Resource Identifier |
<a href="http://www.sciencedirect.com/science/book/9780750672184">http://www.sciencedirect.com/science/book/9780750672184</a> |
| Public note |
An electronic book accessible through the World Wide Web; click for information |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) |
|---|
| Source of classification or shelving scheme |
Dewey Decimal Classification |
| Koha item type |
Electronic Resource |
