000 01368nom a2200385 u 4500
001 10070525
003 upatras
005 20210117201617.0
008 090513s2005 eng
020 _a9783540269458
040 _aGR-PaULI
_cGR-PaULI
041 0 _aeng
100 1 _aSchwizer, JΓΌrg
_966849
245 1 0 _aForce Sensors for Microelectronic Packaging Applications
_h[electronic resource]
_cby JΓΌrg Schwizer, Michael Mayer, Oliver Brand
260 _aBerlin, Heidelberg
_bSpringer-Verlag Berlin Heidelberg
_c2005
300 _bv.: digital
490 0 _aMicrotechnology and MEMS
_x1615-8326
650 4 _aOptical materials
_964444
650 4 _aNanotechnology
_919191
650 4 _aElectronics
_915695
650 4 _aEngineering
_917712
650 4 _aSystem safety
_964896
650 4 _aChemistry
_911013
650 4 _aOptical and Electronic Materials
_964446
650 4 _aNanotechnology
_919191
650 4 _aElectronics and Microelectronics, Instrumentation
_964430
650 4 _aPhysics and Applied Physics in Engineering
_964483
650 4 _aQuality Control, Reliability, Safety and Risk
_964898
700 1 _aMayer, Michael
_966850
700 1 _aBrand, Oliver
_966851
760 1 _aMicrotechnology and MEMS
_x1615-8326
856 4 0 _uhttp://dx.doi.org/10.1007/b138345
942 _2ddc
999 _c46770
_d46770