Microelectronics Packaging Handbook
Microelectronics Packaging Handbook Subsystems Packaging
Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein Eds.
- 2nd ed.
- Boston Kluwer Academic Publishers 1997
- III - xxix, III-4 - III-628, p. fig., tab.
Glossary and Symbols pp. III - 529- III574, Authors' Biographies pp. III-575 - III- 596, Index pp. III-597 - III-628
Table of Contents: Foreword, Preface, Conversion factors, Summary contents, PART 3:MICROELECTRONICS PACKAGING HANDBOOK: SUBSYSTEM PACKAGING, 15.Microelectronics packaging- an overview, 16.Package-to-board interconnections, 17.Printed-wiring board packaging, 18.Coated-metal packaging, 19.Connector and cable packaging, 20.Packaging of optoelectronics with electronics, Glossary and symbols, Authors' biographies, Index.
0 412 08451 1
Μικροηλεκτρονική
HANDBOOK
Μικροηλεκτρονική
621.381 046
Glossary and Symbols pp. III - 529- III574, Authors' Biographies pp. III-575 - III- 596, Index pp. III-597 - III-628
Table of Contents: Foreword, Preface, Conversion factors, Summary contents, PART 3:MICROELECTRONICS PACKAGING HANDBOOK: SUBSYSTEM PACKAGING, 15.Microelectronics packaging- an overview, 16.Package-to-board interconnections, 17.Printed-wiring board packaging, 18.Coated-metal packaging, 19.Connector and cable packaging, 20.Packaging of optoelectronics with electronics, Glossary and symbols, Authors' biographies, Index.
0 412 08451 1
Μικροηλεκτρονική
HANDBOOK
Μικροηλεκτρονική
621.381 046
